外商-Advanced Packaging Lead/Architect

【Job Summary】

Lead chip packaging design, simulation and technical signoff from architecture through mass production. Drive cross-functional collaboration to optimize performance, reliability, manufacturability, cost and time to market.

【Key Responsibilities】

Define packaging architecture, substrate design, interconnects and power delivery strategies.

Lead chip–package–board co-design and design closure.

Oversee SI/PI, thermal and thermomechanical simulations, validation and design signoff.

Drive prototype validation, failure analysis, reliability improvement and production ramp-up.

Collaborate with foundries, OSATs, substrate vendors and internal engineering teams.

Lead and develop the packaging design and simulation engineering team.

【Requirements】

Bachelor's degree or above in Electrical Engineering, Microelectronics, Materials Science, Mechanical Engineering or a related field.

10+ years of experience in chip packaging design, development or simulation, including ownership of projects from concept to mass production.

Strong knowledge of flip-chip/FC-BGA, substrate design, assembly processes and package reliability.

Hands-on expertise in at least one area: package design, SI/PI, thermal or thermomechanical simulation.

Proven leadership, cross-functional collaboration and supplier management experience.

*Preferred: Experience in advanced packaging (2.5D/3D, chiplets, interposers, RDL, TSVs or hybrid bonding) and high-performance computing products such as CPUs, GPUs and ASICs.