Wet Clean Technology Development​ Process Engineer

The Advanced Packaging Development Center (APDC) is a state-of-the-art cleanroom that is among the most advanced wafer-level packaging labs in the world. It houses the industry’s broadest portfolio of products that enable the foundational building blocks of heterogeneous integration, including advanced bump and micro-bump, fine-line redistribution layer (RDL), TSV and hybrid bonding. APDC was established as a joint lab partnership with the Institute of Microelectronics (IME), a research institute of Singapore’s Agency for Science, Technology and Research (A*STAR).

We are currently seeking for an experienced and passionate Wet Clean Technology Development​ Process Engineer to join APDC now. Apply now if you fit the description below!

Key Responsibilities

• In-depth understand a set of unique challenges of wet clean processes for both conventional and unconventional test vehicles in CoW hybrid bonding applications.
• Propose solutions to address the unique challenges of wet cleaning for high-yield hybrid bonding and die stacking using the current generation wet clean module. Proactively initiate and conduct CnF tests to define process & hardware requirements.
• Collaborate with partners to evaluate different wet clean technologies to identify the best wet clean technology​ and process for HBM.
• Deep dive with engineering team and/ or supplier to prototype next gen wet cleans module based on identified technology and process & hardware requirements.
• Evaluate proto chamber for hybrid bonding process for HBM. Own process optimization and drive engineering improvement.
• Wet cleans technology & process subject-matter expect to guide account/field teams on tough wet clean and defectivity related technical issues.

Functional Knowledge

• Good understanding of FEOL wet cleans concept and particle removal is essential.
• Familiar with defectivity characterization (such as Surfscan, AOI, eDR, SEM review) and methodology.
• An industrial track record with hands-on development experience of any wet clean technology is strongly desirable.
• Ability to read fluid diagram is very helpful.
• Any background of WoW or CoW bonding is a bonus.

Opportunities

• On-job training on CoW hybrid bonding processes and challenges. Hands-on on the state-of-the-art integrated hybrid bonder to witness and contribute to the historical industrial inflection from micro-bump to hybrid bonding.
• Oversea training in US by wet clean process experts through OJT.
• Technical training on/ exposure to up & downstream integration processes and interaction with hybrid bonding.
• Patent filing to protect innovative ideas for this new field is encouraged.

Requirements

• Engineering or science university educational background.
• > 3 years industrial experiences on wet cleans technology.
• Backgrounds on wet cleans process and/or hardware development is strongly preferred.
• Backgrounds on defectivity improvement is appreciated.
• 10% travel commitment to the US, Taiwan, Korea or Europe.

Working Location

• Science Park II, Singapore (till 2026). Tampines (after 2026)