Wire Bond Operator I (25671)

Summary:

Operation of manual wire bond equipment in a clean-room environment, to manufacture high-reliability microelectronic devices.

Essential Duties and Responsibilities:

• Read and interpret assembly instructions, drawings and work instruction processes.
• Written tests for ESD + wirebond and ribbon bond requirements.
• Use tools such as fine tipped tweezers, dental probes, x-acto knives.
• Perform pin bonds between substrate and case pins.
• Use pf periodic machines certification for bond strengths.
• Inspect and know the difference between an acceptable epoxy placement, die attach assembly, sub attached assembly and wire bond and ribbon bonds on a hybrid in conformance with prints, drawings and or Mil std.
• Inspect - to the drawings/specs and procedures – the devices for defects before starting the assembly and after finishing his/her part of the assembly.
• Adhere to all ESD and other handling requirements.
• Comply with all in-house training as identified in job specific family and or specific training plan.
• Follow company 6S and continuous improvement (kaizen) objectives.
• Perform all other duties, as assigned.