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Wire Bond Technician

Open 35d reposted 2× · 2 open copies
  • Assists in new equipment setup, resolution of major equipment problems and equipment restoration
  • Provide manufacturing line support in assigned equipment platform and area
  • Assists in the resolution of major equipment problems
  • Generate and maintain shift status report/update
  • Support Uptime and Prodtime improvement
  • Preferably a graduate of Bachelor of Science in Industrial Technology
  • With at least 2-3 years of experience at semiconductor FOL Die bond and Wire bond
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onsemi
last month

TECHNICIAN 4, MANUFACTURING

Open 29d APACFull-time

onsemi is seeking skilled Technicians to support semiconductor manufacturing operations in areas such as Die Bond/Clip Bonding, Wire Bonding The role involves operating and monitoring specialized equipment, performing m…
onsemi
2 months ago

Wire Bond Process Engineer

Open 27d APACFull-time

I. Basic Purpose of the Job •The Wire Bond Process Engineer (Thermosonic) own, characterize, and sustain the thermosonic wire bond process to deliver robust interconnect quality, high yields, and package reliability. Th…
onsemi
4 weeks ago

FOL Equipment Technician

Open 19d APACFull-time

Job Summary: onsemi is seeking a highly motivated Manufacturing Equipment Technician to sustain and run the fab floor with the primary responsibility of resolving equipment and process issues. Technician positions are s…
onsemi
last week

Equipment Technician

APACFull-time

Maintains and troubleshoots semiconductor diffusion manufacturing equipment to maximize uptime and quality, working in a cleanroom and collaborating with engineering teams.
onsemi
3 months ago

Assembly Technicians

Open 27d APACFull-time

Job Summary: onsemi is seeking a highly motivated Manufacturing Equipment Technician to sustain and run the fab floor with the primary responsibility of resolving equipment and process issues. Technician positions are s…
onsemi
2 months ago

Wire Bond Engineer (Ultrasonic)

Open 27d APACPart-time

I. Basic Purpose of the Job •The Ultrasonic Wire Bond Process Engineer owns, characterizes, and sustains ultrasonic wire bonding processes to deliver robust interconnect quality, high yields, and reliable semiconductor…