(下世代光互聯解決方案) 機構工程師 Mechanical Engineer – Optical Module Packaging

我們正開發面向超大型資料中心(Hyperscale Data Centers)與人工智慧AI應用的下一代高速光收發器與光互連解決方案。技術路線將從既有pluggable form factor的1.6Tb/s光收發器出發，逐步推進至Near-Packaged Optics (NPO)和Co-Packaged Optics (CPO)，以支援世界領先 AI客戶的大規模橫向擴展scale-out與縱向擴展scale-up系統架構。

《工作內容》
•本職位負責光電模組之機構與熱設計，需在不同主導限制條件下(例如電功率密度或光功率密度)，設計具備高可靠度與量產可行性的解決方案。
•設計光電模組之機構件與封裝結構
•進行模組熱設計，包括散熱結構、氣流評估與模擬分析
•支援高密度光電封裝與模組可靠度分析
•與硬體與光學工程師協作，完成堆疊、公差與量產設計
•評估材料、製程、可靠度與成本之可行性

We are developing advanced optoelectronic modules and high‑speed optical interconnect solutions for hyperscale data centers and artificial intelligence computing platforms. This role participates in design across diverse electrical and optical architectures, covering both highly integrated high‑speed data paths and low‑speed, high‑stability optical source control systems. The candidate will collaborate closely with cross‑functional teams to drive products from development into volume production and customer deployment.
This role requires the ability to work across multiple optical module architectures with differing design constraints, and to appropriately adjust design scope, optimization targets, and trade‑offs based on those constraints.

Responsibilities
•This role is responsible for the mechanical and thermal design of optoelectronic modules, and requires the ability to develop high‑reliability, production‑ready solutions under different dominant constraints (e.g., electrical power density or optical power density).
•Design mechanical components and packaging structures for optoelectronic modules.
•Perform module‑level thermal design, including heatsink structures, airflow evaluation, and thermal simulation.
•Support high‑density optoelectronic packaging and module reliability analysis.
•Collaborate with hardware and optical engineers to complete stacking, tolerance analysis, and designs for mass production.
• Evaluate the feasibility of materials, manufacturing processes, reliability, and cost.

※ 工作地點：中壢/八德/新竹

Requirements

學歷：大學、碩士
《必要條件Qualifications》
•機械、材料或相關科系學士以上 Bachelor’s degree or above in Mechanical Engineering, Materials Science, or a related field.
•熟悉機構設計與3D CAD. Proficiency in mechanical design and 3D CAD tools.
•基本熱流、結構與可靠度概念 Fundamental understanding of thermal management, structural mechanics, and reliability concepts.

《加分條件Nice to Have》
•具光電模組、伺服器或高效能運算設備經驗 Experience with optoelectronic modules, servers, or high‑performance computing equipment.
•高功率產品散熱設計經驗 Hands‑on experience in thermal design for high‑power products.
•熟悉資料中心環境條件與相關規範 Familiarity with data center environmental conditions and relevant standards.