[新加坡] 半導體龍頭品牌 - Staff Process Integration Engineer, NTI NAND

⭐Locate in Singapore, 薪資將依據經歷背景, 依當地薪資水平討論

[Responsibilities]
1. Own and lead one or more process modules for 3D NAND integrated circuit development and manufacturing.
2. Define structural specifications and process requirements for assigned modules.
3. Set the module's technical direction and vision, and drive a continuous improvement roadmap.
4. Identify structural, electrical, and reliability risks early and resolve them through process control, using a model-based problem-solving approach.
5. Drive structural development, electrical performance, parametric verification, and process control, and optimize manufacturability.
6. Characterize materials physically and electrically, and partner with process teams to select new materials and transition them from R&D to production.
7. Design and execute device and process experiments; analyze and report results with sound statistical conclusions.
8. Build and lead a cross-disciplinary development team, including process engineers, to deliver module goals.
9. Make key decisions and set clear direction, goals, and metrics for the team.
10. Innovate on complex technical problems, explore new technology options, and regularly submit patent disclosures.
11. Coordinate cross-functional teams to ensure fast, low-error project execution.
12. Support technology transfer from R&D to high-volume manufacturing (HVM).
13. Present key findings and project updates, drive decisions, and facilitate team discussions.
14. Continuously develop technical and leadership skills through on-the-job training and education.

[AI Responsibilities]

• Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, and effectiveness, with sound judgment and in compliance with company standards and legal requirements.
• Promote continuous improvement by identifying, testing, and sharing AI-enabled enhancements within your scope.

[Requirements]

• 5+ years of wafer fab process development experience in Dry Etch, Photolithography, Thin Films, Wet Process, CMP, or Process Integration.
• Strong understanding of PI modules for advanced NAND technologies and related structural and electrical failure mechanisms.
• Hands-on experience with non-volatile memory (NAND), including the NAND process flow, process-device interactions, and common yield and reliability issues.
• Experience in R&D and technology transfer to manufacturing.
• Digital fluency and role-appropriate AI literacy to use AI tools responsibly and effectively for research, analysis, content creation, and problem-solving.
• Strong commitment to quality, collaboration, and continuous improvement.
• Self-motivated and able to thrive in a fast-paced, dynamic environment.

[Preferred]

• Proficiency in programming, engineering, BI, or analytics tools such as Python, SolidWorks, Tableau, or Power BI.