【新竹】硬體設計工程師 Hardware Design Engineer（Base Band）

【職務摘要Job Summary】

Ubiik 為全球領先的私有無線網路（Private LTE / LPWAN）解決方案供應商，深耕智慧電網與物聯網領域，自 2018 年起累計於台灣部署逾 150 萬具智慧電表，並持續拓展北美、歐洲及亞太市場。隨著產品線與國際業務快速成長，我們正尋找一位硬體設計工程師，負責私有 LTE 基站、LPWAN 閘道器及無線通訊模組等產品之硬體開發，涵蓋架構定義、電路設計、Layout Review、驗證測試至量產導入，並與 RF、韌體、機構及製造團隊密切合作。本職缺不限職級，將依應徵者經驗與能力規劃相應職責。

【主要職責 Key Responsibilities】

1.依產品規格定義硬體架構，完成電路設計（Schematic Design）、Layout 規劃與 Review 及 Gerber 發行
Define hardware architecture based on product specifications; complete schematic design, layout planning and review, and Gerber release.
2.執行電子零組件之評估、選型與測試，並規劃第二料源，兼顧成本、供貨與長期供應
Evaluate, select, and test electronic components, and plan second sources while balancing cost, availability, and long-term supply.
3.參與新產品規格制定，從硬體可行性角度提供技術建議
Participate in defining new product specifications, providing technical input on hardware feasibility.
4.執行 EE 功能驗證、失效分析與根因診斷，解決產品與平台之系統層級問題
Perform EE functional verification, failure analysis, and root-cause diagnosis to resolve system-level issues across products and platforms.
5.規劃並維護測試計畫，於測試方法或判定基準變更時同步更新
Plan and maintain test plans, updating them whenever test methods or acceptance criteria change.
6.建立與維護 BOM，負責 ECN 之提出與審查
Create and maintain BOMs; initiate and review ECNs (Engineering Change Notices).
7.支援試產（EVT / DVT / PVT）導入，處理產線異常與良率問題
Support pilot production builds (EVT / DVT / PVT) and resolve production-line anomalies and yield issues.
8.依產品藍圖及 RMA 分析結果，執行既有產品之改版與升級
Carry out revisions and upgrades of existing products based on the product roadmap and RMA analysis results.
9.參與跨部門工程會議，負責硬體相關之技術溝通與時程規劃
Participate in cross-functional engineering meetings, owning hardware-related technical communication and schedule planning.
10.資深人選將獨立主導產品線之硬體開發，擔任 EE 技術決策者，並指導初階工程師、協助建立團隊設計規範與 Design Review 機制
Senior candidates will independently lead hardware development for a product line, serve as the EE technical decision-maker, mentor junior engineers, and help establish team design guidelines and design review processes.

【必備條件Must Have】

1.電機、電子、通訊工程或相關科系學士以上
Bachelor's degree or above in Electrical Engineering, Electronics Engineering, Communications Engineering, or a related field.
2.具備硬體電路設計基礎與實務經驗；資深職級需具 5 年以上硬體設計經驗，並具產品從設計到量產（完整 NPI 流程）之經驗
Solid foundation and hands-on experience in hardware circuit design; senior-level candidates should have 5+ years of hardware design experience, including taking products from design to mass production (full NPI cycle).
3.熟悉 PADS 與 OrCAD Capture
Proficiency with PADS and OrCAD Capture.
4.具備高速數位、電源及介面電路之設計能力
Ability to design high-speed digital, power, and interface circuits.
5.具備硬體除錯能力，熟悉示波器、頻譜分析儀等量測儀器
Strong hardware debugging skills and familiarity with test equipment such as oscilloscopes and spectrum analyzers.
6.英文讀寫流利（需閱讀原文規格書並與海外團隊書面溝通）
Fluent written English (required for reading original datasheets and specifications and for written communication with overseas teams).
7.良好的跨部門溝通能力與團隊合作精神
Strong cross-functional communication skills and a collaborative team spirit.

【加分條件Nice to Have】

1.具備 EMI/EMC 設計與認證（CE / FCC / NCC / BSMI）實務經驗
Hands-on experience with EMI/EMC design and certification (CE / FCC / NCC / BSMI).
2.具備 WiFi 閘道器、路由器、LTE CPE 或小型基地台等無線產品開發經驗者尤佳
Experience developing wireless products such as Wi-Fi gateways, routers, LTE CPE, or small cells is highly desirable.
3.具備 RF 電路設計或量測經驗（RF 前端、功率放大器、天線介面）
Experience in RF circuit design or measurement (RF front-end, power amplifiers, antenna interfaces).
4.具備機構設計（散熱抗震）之經驗
Experience with mechanical design considerations (thermal management and vibration resistance).
5.具備與工廠合作量產經驗（包含試產導入與產線問題排除）
Experience working with factories on mass production, including pilot-run introduction and production-line troubleshooting.
6.具備帶領小型團隊或指導工程師之經驗
Experience leading a small team or mentoring engineers.