研發-IC Package Bumping Design Engineer-湖口廠-ATT250031

The Advanced Product Development Team at Amkor has an opening for bumping mask design Engineer. This team is responsible for wafer & wafer level package physical mask & stencil design, design implementation, design verification, and mask tooling order for Amkor customers.

Job responsibilities for this position include physical mask & stencil design/layout for wafer bumping & wafer level packages, generating wafer map & reticle tooling documents, design rule implementation, design/drc verification & report, mask tooling, and co-working with factory internal teams on process & quality enhancement. This involves optimizing Bump and WLP mask design, design implementation to meet process & quality requirements, and assembly constraints.