研發-Package Design Engineer-台元辦公室-ATT240059

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The Advanced Product Development Team at Amkor has an opening for IC Package design engineer. This team is responsible for design methodology, design implementation and verification for FCBGA, FCCSP, and WB CSP products for Amkor customers.

Job responsibilities for this position include package selection and package design. This involves optimizing system co-design of IC and Package, IC floor-planning, ball array optimization to meet signal & power integrity, assembly, thermal, and reliability constraints.

Additional responsibilities includes, RDL and bump pattern/assignment, System level co-design methodology of IC, Package and PCB/Board, Package selection based on requirements for assembly, substrate process, mechanical, thermal and electrical performance, Package design flow SOP/methodology management, implementing high speed interface with SI & PI constraints, and Working with BU/PDE on package analysis and selection.