硬體工程師（電源設計）/ Hardware Engineer (Power Electronics)

你是不是不滿足於拿現成模組拼裝，更想親手畫出自己的電路板，讓每一顆電池都在你的掌控之中？

在 Valtec，我們正從「整合外購模組」走向「自主設計電力與電子硬體」，而這個職位就是這場轉變的核心。你將從零開始建立我們的電源系統、電池管理（BMS）與 PCB 設計能力，讓無人機在嚴苛的海上環境中更穩定、更輕巧、整合度更高。我們要找的不是只會照規格書做事的人，而是能把設計從線路圖一路帶到上機測試、遇到問題會追根究柢的夥伴。如果你想打造屬於自己的硬體，而不只是組裝別人的，歡迎加入我們！

Tired of piecing together off-the-shelf modules and ready to design your own boards from scratch?

At Valtec, we're moving from integrating third-party modules to designing our own power and electronics hardware in-house, and this role sits at the center of that shift. You'll build our in-house capability in power systems, battery management (BMS), and PCB design, making our drones more reliable, more compact, and better integrated for demanding maritime environments. We're looking for someone who can take a design from schematic all the way to flight testing, and who won't stop until they find the root cause. If you want to build your own hardware, not just assemble someone else's, let's talk.
---

【主要工作任務 / Key Responsibilities】

1. 電源系統與電池管理設計 / Power System & BMS Design
・主導無人機電源架構設計，包含電源轉換、配電與保護電路。
Lead the design of the drone power architecture, including power conversion, distribution, and protection circuits.
・開發自有電池管理系統（BMS），涵蓋電芯監測、均衡、保護與電量／健康狀態估算（SoC/SoH）。
Develop our in-house BMS, covering cell monitoring, balancing, protection, and SoC/SoH estimation.

2. PCB 電路設計與 Layout / PCB Design & Layout
・負責電路圖設計、元件選型與 PCB layout，並與板廠協作完成製板與驗證。
Own schematic design, component selection, and PCB layout, working with PCB vendors through fabrication and validation.
・在設計中兼顧電源完整性、訊號完整性、散熱與 EMI/EMC。
Design with power integrity, signal integrity, thermal performance, and EMI/EMC in mind.

3. 感測器與航電整合 / Sensor & Avionics Integration
・整合飛控、GNSS、IMU、通訊模組等航電與感測器，設計介面電路與線束。
Integrate flight controllers, GNSS, IMUs, communication modules, and other sensors, and design the interface circuits and wiring harnesses.
・與韌體團隊協作，完成硬體介面（UART、I2C、SPI、CAN 等）的驅動與系統驗證。
Work with the firmware team to bring up and validate hardware interfaces (UART, I2C, SPI, CAN, etc.).

4. 機電整合與小型化 / Electromechanical Integration & Miniaturization
・與機構團隊合作，在空間與重量限制下優化電子模組配置、散熱，以及防水、防鹽霧設計。
Work with the mechanical team to optimize electronics placement, thermal management, and waterproofing and salt-spray protection within tight space and weight limits.
・推動模組整併與小型化，提升整機整合度與可靠度。
Drive module consolidation and miniaturization to improve system integration and reliability.

5. 硬體測試與除錯 / Hardware Testing & Debugging
・建立硬體測試流程與驗證標準，執行功能、環境與可靠度測試。
Set up hardware test procedures and validation standards, and run functional, environmental, and reliability tests.
・執行失效分析與除錯，從實驗室到現場持續提升產品穩定度。
Perform failure analysis and debugging, improving product stability from the lab to the field.