【竹北】Hardware Application Engineer – IP Camera / IoT (3093930)
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Qualcomm Semiconductor Corporation_高通半導體有限公司 【竹北】Hardware Application Engineer – IP Camera / IoT (3093930)
Description
【Talents who apply job through Qualcomm Career Website will be reviewed and considered as top priority】
Please apply directly on Qualcomm Career Site via link below, and attach your English resume for further review. Thank you!
https://qualcomm.wd12.myworkdayjobs.com/zh-CN/External/job/Zhubei-City-TWN/Hardware-Application-Engineer---IP-Camera---IoT_3093930
【PRINCIPAL DUTIES AND RESPONSIBILITIES】
- Design, develop, and evaluate electronic systems for Qualcomm IE-IOT SoC platforms, including Digital and Analog circuits for IoT and industrial computing applications.
- Develop schematics, PCB layouts, and design reviews; perform component selections and guide PCB layout execution for retail and industrial electronic equipment.
- Collaborate with internal or third-party manufacturing contacts to fabricate and bring up hardware systems.
- Work closely with cross-functional teams (mechanical, thermal, SI, PTE, regulatory, validation, manufacturing, etc.) and ODMs for execution of projects from concept to production.
- Conduct detailed reviews and analysis of designs to ensure implementation meets appropriate power, performance, area, compliance, and cost requirements.
- Coordinate and perform specialized analyses (e.g., feasibility studies, signal integrity, power integrity) to verify design performance.
- Test development systems to ensure performance and compliance requirements are met, and support functional validation including issues triage and root cause analysis.
- Provide technical training for customers and ODMs, including product demonstrations and technical guidance on hardware design.
- Facilitate consensus on technical trade-offs at hardware, software, and design levels across cross-functional teams.
- Develop and support customer-specific hardware and system requirements in collaboration with internal teams and ODMs.
- Prepare and present technical documentation, design reviews, and execution status updates to stakeholders.
- Resolve architecture and design issues across system and card levels, and contribute to the debug and bring-up of hardware systems.
- Participate in determining objectives of assignments and plan, schedule, and arrange own activities in accomplishing objectives.
【REQUIRED COMPETENCIES】
Board-Level Hardware Design
- Proficiency in electronic system design including hardware system design, system integration, schematic capture, and circuit simulation software.
- Experience with PCB design for high-speed, multi-layer stack-ups encompassing application processors, digital processors, and power delivery networks.
- Familiarity with COTs IoT interfaces and advanced manufacturing techniques (e.g., stacked micro-vias, sequential lamination).
High-Speed Interfaces & Signal Integrity
- Knowledge of high-speed serial I/O, PCIe, LPDDR/DDR memory interfaces, USB, MIPI, HDMI, and GbE interfaces.
- Experience with signal integrity and power integrity analysis and compliance requirements.
Hardware Validation & Debug
- Hands-on experience with hardware validation and standard measurement instruments (e.g., oscilloscopes, logic analyzers, protocol analyzers).
- Proven ability to independently lead or support hardware bring-up, debug, and root cause analysis.
Collaboration & Communication
- Strong collaboration skills with internal cross-functional teams and external ODM/JDM partners.
- Excellent verbal and written communication skills; ability to prepare and deliver design reviews and technical documentation.
- Effective multitasking ability to meet aggressive schedules in a dynamic environment.
Tools
- Proficient in schematic capture and PCB layout tools such as Cadence Allegro, Siemens/Mentor Xpedition, or Altium.
- Proficient with all MS Office 365 tools; understanding of how to use AI to efficiently solve engineering problems.