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Winbond Electronics

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(竹北) MCU/SoC IC Design Engineer

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Summary

Winbond Electronics is hiring an MCU/SoC IC Design Engineer at its Zhubei office (Hsinchu County, Taiwan, onsite) to design compute-in-memory (CIM) SoCs, develop SoC modules, and handle SoC design, integration, and verification. Requires a master's degree in electrical/electronic engineering, 5+ years of relevant experience, and advanced English.

【工作內容】

作為華邦的(竹北) MCU/SoC IC Design Engineer,

1. Design CIM SoCs and modules. 2. Develop modules for CIM-based SoCs. 3. SoC design, integration, and verification.

【工作地點】竹北辦公室(新竹縣竹北市文興路二段539號)


【條件要求】

學歷要求:碩士
科系要求:電機電子工程相關 │ │
相關經驗:5年以上
語言能力:英文 高級 │ │
管理責任:No
輪班需求:No
出差需求:無
外派需求:No

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