Senior DevOps Engineer on Winbond Electronics' IT R&D team in Zhubei (Hsinchu) / Taichung, Taiwan, building internal information-system platforms. Daily work spans DDD microservice development on .NET, Azure containerized deployment (APIM/Event Hub), IaC and CI/CD with GitHub Actions, and driving AI (AI Agents, MCP) into the SDLC.
Sign in to see your match