Lead Embedded
4 years of experience New York
Open to
EmbeddedSoftware EngineeringBackendEngineering DesignHardware
Experience
Device Engineer 2023 — Present
Embedded Firmware Lead (W114C Chime - Low-Cost Doorbell Chime) 2024 — Present
Embedded Software Engineer (In-House OS Abstraction Layer) 2023 — 2023
Firmware Engineer (Gunshot Detector - NAND Flash Driver & Bootloader) 2023 — 2024
DSP Pipeline Engineer (Smart Noise Sensor - PDM Driver & DSP Integration) 2023 — 2024
Education
Bachelor's degree · 2022