神準科技股份有限公司
Open positions
(16B1)BSP軟韌體工程師
Position Purpose : 1. Develop and maintain x86 (Intel/AMD) BSP solutions. 2. Act as the core technical contact, collaborating with internal teams (HW, BIOS) and assisting customers to resolve technical issues from…
(1661)Wi-Fi AP 軟體工程師 -林口
1. Develop, maintain, and troubleshoot Wi-Fi AP firmware features. 2. Maintain related modules such as hostapd, Linux/OpenWrt networking, and Wi-Fi driver interaction. 3. Analyze Wi-Fi field issues and customer…
(17B6) IOT 軟/韌體工程師-林口
1. Firmware development for IoT product. 2. Bring up board and BSP development. 3. Device driver porting. 4. Product verification and trouble shooting. 5. Manufacture issues supports.
(16C0)軟/韌體資深/主任工程師 (x86 BSP)
1. Firmware Development based on BSP/SDK of Intel x86 platform. 2. Porting device drivers to target platform. 3. Product's functional and performance verification. 4. Experienced with programming some of the following…
(16C3)Server軟韌體測試資深工程師
1、Responsible for testing server BMC firmware and functionality, including creating and executing test plans and cases, and validating Web UI, IPMI commands, and Redfish API features. 2、Responsible for testing server…