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Designs and optimizes high-bandwidth memory (HBM) and 3D-stacked DRAM architectures for semiconductor products, collaborating with U.S. customers to solve technical challenges and improve performance.
Leads design and implementation of high-speed digital IP for 3D-stacked DRAM peripheral circuits and DFT, co-developing DRAM-on-Logic configurations with U.S.-based customers and managing foundry verification and IP integration services. Day-to-day work centers on RTL design to implementation in Verilog/VHDL, memory PHY/controller IP, BIST/DFT, and physical design.
About SK hynix America: At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering…
Korean–English interpreter/translator at semiconductor maker SK hynix, providing live interpretation for executive meetings, trainings, and events and translating business documents. Requires native-level fluency in both languages and US work authorization (no visa sponsorship).
Supports planning and execution of construction projects for semiconductor facilities, coordinating with contractors and monitoring schedules.
Leads end-to-end development of advanced packaging system architectures, focusing on High Bandwidth Memory (HBM) integration in 2.5D/3D environments. Drives SiP roadmap strategy, cross-functional collaboration, and R&D for next-generation semiconductor packaging.
Designs and implements compensation structures while analyzing market data and performance reviews to ensure equitable pay. Uses Radford, ADP WorkforceNow, and Excel to provide data-driven insights to HR leaders.
Analyzes venture investment opportunities in semiconductor/data center tech, conducts due diligence, and manages portfolio updates for SK hynix’s AI-driven memory solutions.
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