台灣瑞薩電子股份有限公司
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Staff IC Package Design Engineer (20035067)
APACStaff
Taiwan
Nanzi District, Kaohsiung City■Company Description We are seeking a highly experienced IC Package Design Engineer with extensive expertise across a broad range of semiconductor package types. The ideal candidate is proficient in industry-standard…
Ansys Assembly AutoCAD
1 views 4 weeks ago
Staff Package Design Engineer- Expose die/MIS
APACContractStaff
Taiwan
Zhubei City, Hsinchu County■Job Summary Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging, GaN related PKG is…