/

Point your AI agent at freehire and let it find you a job. A CLI and an MCP server over the whole job API — no browser.

Get the CLI →

Winbond Electronics

47 jobs

Posted Sort

47 jobs Posted Sort

Winbond Electronics

(竹北 / 台中) Senior Full Stack Engineer

Open 45d APACSenior

Senior Full Stack Engineer on Winbond's internal IT R&D team in Zhubei (Hsinchu, Taiwan), building and operating enterprise information systems. Day-to-day spans DDD/microservice design with C#/.NET Core, Vue 3 or React frontends, Azure containerized deployments (APIM/Event Hub), IaC and CI/CD via GitHub Actions, and driving AI-Driven SDLC practices like AI Agents and MCP.

AI Azure ChatGPT CI/CD C# +13 skills

Winbond Electronics

(竹北 / 台中) Senior DevOps Engineer

Open 45d APACSenior

Senior DevOps Engineer on Winbond Electronics' IT R&D team in Zhubei (Hsinchu) / Taichung, Taiwan, building internal information-system platforms. Daily work spans DDD microservice development on .NET, Azure containerized deployment (APIM/Event Hub), IaC and CI/CD with GitHub Actions, and driving AI (AI Agents, MCP) into the SDLC.

AI API Azure Bicep ChatGPT +19 skills

Winbond Electronics

(竹北) Compliance & Risk Management Manager / Specialist

作為華邦的(竹北) Compliance & Risk Management Manager / Specialist ，你將協助內部需求部門建置完善的資訊系統平台，促進企業內部運作並提升生產力。工作內容包含：，以下為工作內容、工作條件以及重要通知。【工作內容】 1. 資訊安全制度推展與維護：負責規劃與推展集團組織的資訊安全制度，確保制度運行符合相關標準和規範，以及維護資訊安全政策、規範與程序文件。 2.…

Cism Cissp ISO 27001 Nist

Winbond Electronics

(竹北 / 台中)SAP Software Developer

Winbond Electronics is hiring an SAP Software Developer at its Zhubei (Hsinchu) office in Taiwan to build and maintain internal SAP systems supporting business operations. Day-to-day work spans SAP architecture and ABAP/Webdynpro development, requirements analysis with product managers, system maintenance and troubleshooting, and performance/security optimization using SQL/MSSQL.

ABAP SAP SQL SQL Server

Winbond Electronics

(竹北) DRAM Circuit Designer

Design DRAM peripheral circuits for DDR3/DDR4/LPDDR3/LPDDR4 memory products and perform full-chip verification at Winbond's Zhubei office in Hsinchu County, Taiwan, collaborating with process R&D, CAD, product test, and FAE teams.

Winbond Electronics

(竹北) EDA Infrastructure Engineer (CAD & HPC Systems)

At Winbond Electronics in Zhubei, Taiwan, this onsite engineer builds and maintains the Linux-based IC design infrastructure — servers, storage, user environments and LSF job scheduling — while installing and supporting CAD/EDA tools and monitoring HPC system performance for chip designers.

Winbond Electronics

(Ipoh/Malaysia)Warehouse Operations Engineer [倉儲作業工程師]

【Job Responsibilities】 As a Warehouse Operations Engineer at Winbond, you will manage receiving, material issuing, and inventory control including stocktaking. You will handle surplus and scrap materials, scrapping and…

Winbond Electronics

(Ipoh/Malaysia)Test Integration Engineer [測試整合工程師]

Winbond Electronics is hiring a Test Integration Engineer at its Chemor (Ipoh area), Perak, Malaysia site. Day to day, the engineer analyzes and maintains semiconductor product test yield, supports new product introduction and validation, optimizes test parameters, and releases test equipment and programs to drive production quality and efficiency.

Winbond Electronics

(竹北) CAD AI Program Manager

Program manager at Winbond (Zhubei, Taiwan) who brings automation and AI into the DRAM/Flash chip-design CAD environment: analyzing design logs and flow data to find bottlenecks, building Python/statistics/LLM-based analysis tools and PoCs, and rolling out improvements with circuit-design and CAD teams. Requires a master's degree, 10+ years' experience, and advanced English.

AI CAD LLM Machine Learning Prompt Engineering +1 skills

Winbond Electronics

(竹北) Senior Software Product Manager

Open 45d APACSenior

Winbond Electronics is hiring a Senior Software Product Manager at its Zhubei, Taiwan office to manage internal enterprise systems (CRM/quality management), overseeing project delivery and long-term product strategy while coordinating with developers and stakeholders. Requires 5+ years of product/project management experience, agile tools (Jira/Confluence), MS SQL, and IT architecture collaboratio

API Confluence Jira SAP

Winbond Electronics

(竹北)DRAM Circuit Design Engineer

作為華邦的(竹北)DRAM Circuit Design Engineer ，你將負責替客戶設計符合需求的電路圖，與製程研發/CAD/產品測試/FAE等團隊合作，完成重要專案。工作內容包含：，以下為工作內容、工作條件以及重要通知。【工作內容】 1. DDR2/DDR3/DDR4/LPDDR2/LPDDR4 Circuit design 2. New Product engineering validation 3. FA…

Winbond Electronics

數位電路設計工程師 / Digital Design Engineer_PM50

Winbond Electronics is hiring a Digital Design Engineer in Hsinchu, Taiwan to design flash memory logic circuits, data integrity algorithms, and data protection circuits, working with process, CAD, product test, and FAE teams. Core tech: memory chip design with RTL and Verilog/UVM verification.

Winbond Electronics

(竹北) Software Product Manager_HR系統

In-house IT product manager at Winbond Electronics (Zhubei, Taiwan) owning HR information systems: configuring and maintaining SAP SuccessFactors, supporting HR digital transformation, and managing HR system requirements and development. Full-time onsite role; 1+ year experience and SAP/SuccessFactors/EC familiarity preferred.

SAP SuccessFactors

Winbond Electronics

(竹北)Logic/Digital Circuit Design Engineer

【工作內容】作為華邦的(竹北)Logic/Digital Circuit Design Engineer，你將負責替客戶設計符合需求的電路圖，與製程研發/CAD/產品測試/FAE等團隊合作，完成重要專案。工作內容包含： 1. Analog Circuit Design & Simulation 2. NOR Flash Circuit Verification & Debug 3. NOR Flash…

Winbond Electronics

(竹北) Senior Software Product Manager_客製化內部應用系統

Open 45d APACSenior

Senior Software Product Manager at Winbond Electronics (Zhubei, Taiwan office) who owns customized internal employee-service systems: defining product strategy, managing the full system lifecycle with Scrum, integrating RPA/workflow automation, and driving cross-department process automation using MS SQL/MySQL, Jira/Confluence and data analysis.

API Confluence .NET Jira MySQL +3 skills

Winbond Electronics

(台南)Senior DRAM Circuit Design Engineer

Open 45d Senior

【工作內容】作為華邦的(台南)Senior DRAM Circuit Design Engineer，你將負責替客戶設計符合需求的電路圖，與製程研發/CAD/產品測試/FAE等團隊合作，完成重要專案。工作內容包含： 1. DRAM Circuit design and simulation 2. Design verification and Failure Analysis 【條件要求】學歷要求：大學…

Winbond Electronics

(竹北) CAD AI Engineer

Winbond Electronics is hiring a CAD AI Engineer at its Zhubei (Hsinchu County) office in Taiwan to build internal AI tooling for engineering teams: RAG systems over documents, Jira and logs, LLM integration (e.g. Gemma, LLaMA), data processing pipelines, and APIs wired into EDA/flow tools. Full-time, onsite, no management or shift duties.

AI API Automation CAD FAISS +14 skills

Winbond Electronics

(IL)Senior HW/SW Application Engineer

Open 45d Senior

Senior HW/SW Application Engineer: We are looking for a customer-focused Senior SW/HW Application Engineer to drive the integration of our advanced Secure Flash technologies. In this role, you will proactively engage…

Embedded Software Embedded Systems Firmware Oscilloscope Python

Winbond Electronics

(竹北) DRAM Circuit Designer

Full-time onsite DRAM Circuit Designer at Winbond's Zhubei (Hsinchu County, Taiwan) office, designing standard DDR/LPDDR and customized DRAM peripheral/array circuits, including functional block and full-chip circuit design and verification using a full-custom design flow.

Winbond Electronics

(竹北) AI Adoption Program Manager

An in-house AI Transformation Program Manager at Winbond Electronics (Zhubei, Hsinchu, Taiwan) who drives company-wide AI tool adoption: planning rollout strategy, building AI literacy training and learning paths, managing change and user communities, tracking adoption metrics, and supporting AI governance.

AI Ai Enablement