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Winbond Electronics

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47 jobs
Winbond Electronics
9 views last week

(竹北) AI Solutions Engineer-EDA & Infrastructure

Open 45d APAC
Taiwan

AI Solutions Engineer at Winbond building AI infrastructure for IC design teams in Zhubei, Taiwan: deploying and fine-tuning on-premise open-source LLMs with RAG in air-gapped environments, developing AI-driven log-analysis/parsing tools for EDA systems, and promoting internal AI adoption. Core stack: Python, Linux, LLM fine-tuning and serving.

AI API Bash CAD Fine Tuning +9 skills
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Winbond Electronics
7 views last week

(中科)Data Scientist Engineer

Open 31d APAC
Taiwan

Data Scientist Engineer at Winbond Electronics in the Central Taiwan Science Park (Taichung), building statistical analysis and machine learning projects and maintaining MLOps/DevOps systems to support internal departments. Core stack is Python and SQL, with preferred Docker/Kubernetes and deep learning/computer vision experience.

DevOps Docker Kubernetes MLOps Python +1 skills
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Winbond Electronics
7 views last week

(竹北) Data Engineer

Open 16d APAC
Taiwan

Data Engineer at Winbond Electronics' Zhubei (Hsinchu, Taiwan) office. Day to day: gathering requirements from internal departments (sales, HR, finance, QA), mapping ERP/IT data sources, and building the enterprise data warehouse, ETL/ELT pipelines, and data quality/lineage mechanisms that support BI and AI. Core stack: SQL, Python, Databricks, Fabric, Power BI.

AI Cloud Data Lineage Data Pipelines Data Quality +8 skills
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Winbond Electronics
2 views last week

(中科)EAP/EES Software Engineer

作為華邦的(中科)EAP/EES Software Engineer，你將成為打造世界一流智慧工廠的一份子，負責建置並維護全自動化智慧工廠的生產資訊系統，以兼具創意與效率的IT手法解決工廠問題，進而提昇生產品質與效率。 EAP/EES 工程師必須擁有製程與機台相關的基本知識，結合 SEMI Standard 與 程式開發能力，理解並分析使用者真實需求，進而設計功能、開發系統並上線維運。 [Responsibilities &…

AI Angular C# .NET Git +5 skills
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Winbond Electronics
4 views last week

(竹北) Software Product Manager PLM Applications 系統

作 為華邦的(竹北) Software Product Manager PLM Applications 系統 ，你將協助內部需求部門建置完善的資訊系統平台，促進企業內部運作並提升生產力。工作內容包含： ，以下為工作內容、工作條件以及重要通知。 【工作內容】 1. 負責記憶體半導體產品生命週期（PLM）相關應用系統之軟體產品需求分析、產品規劃與功能設計 2. 蒐集使用者需求、分析業務流程，將需求轉化為系統功能與規格 3.…

Agile API Cloud Confluence Jira +1 skills
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Winbond Electronics
4 views last week

(竹北) Senior Software Product Manager Enterprise Applications 系統

Senior

作 為華邦的(竹北) Senior Software Product Manager Enterprise Applications 系統 ，你將協助內部需求部門建置完善的資訊系統平台，促進企業內部運作並提升生產力。工作內容包含： ，以下為工作內容、工作條件以及重要通知。 【工作內容】 1. 負責記憶體半導體產品生命週期（PLM）及企業支援服務（Audit/Legal/IP）相關應用系統之軟體產品策略與發展規劃 2.…

Agile AI API Cloud Scrum +1 skills
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Winbond Electronics
7 views 2 weeks ago

(竹北)Field Application Engineer

Open 45d APAC
Taiwan

Winbond Electronics is hiring a Field Application Engineer in Zhubei, Taiwan to provide pre-sales and after-sales technical support for Flash memory products — design-in hardware/software support, failure analysis, on-site customer support, and exhibition assistance. The role requires embedded systems knowledge, Linux/Unix/U-Boot familiarity, and basic programming skills.

Linux Pre-sales Unix
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