英屬開曼群島商世芯股份有限公司台灣分公司
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2 jobs
4 views 2 weeks ago
Sr. Assembly Package Engineer (Co-design)
APACSenior
Taiwan
Zhubei City, Hsinchu County1. Collaborate with OSATs' engineering/substrate design team and IC designer/SIPI team to deliver robust package design solutions. 2. Participate IC package substrate design review, and initiate package specs and…
Pre-sales
2 views 2 weeks ago
Sr. Substrate Design Engineer
APACSenior
Taiwan
Zhubei City, Hsinchu County1. Flip chip package substrate design, and 2.5D experience is a plus. 2. Provide optimization design proposal. 3. Co-work closely with substrate suppliers/SIPI team directly. 4. Design rule maintenance.