G260016-General Solution Architect (竹科)

※Job Contents
1) Handle project execution & management for advanced ASIC chip from Netlist-in to GDSII tapeout and silicon bring-up at prototype stage.
2) Involve pre-sale activities, including tech capability promotion, process selection, IP selection, chip implementation tech proposal and SOW drafting.
3) Some business travel is expected.

※Requirements:
1) Background : SoC chip Implementation Project lead, Physical design(APR) lead, DFT design lead, or RTL chip integration lead.
2) Good communication and program management skill.
3) Familiar with ASIC design flow and TSMC advanced technology.
4) 10+ years relevant experience in semiconductor industry.
5) Bachelor’s degree or above in EE, CS or related field.