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Physical Design Engineer

Open 17d

Summary Description:

Syntiant Corp., a leader in the high-growth AI software and semiconductor solutions space, is looking for an experienced and talented Physical Design Engineer to take on a critical role with expansive responsibilities to enhance the Hardware Engineering function in a growing organization.

As Physical Design Engineer, you will be a key player in the ASIC R&D team. You are presented with a unique opportunity to drive the complete physical design flow, from RTL-to-GSDII to achieve best in class PPA for the next generation Syntiant ASICs while working in a cross-functional environment interacting with multiple teams.

Requirements

Specific Duties and Responsibilities:

  • Drive next generation physical design work to achieve best in class PPA for Syntiant’s next generation ASICs.
  • RTL to GDSII Physical Design Implementation, including Synthesis, Pad Ring, Floorplan, Placement, Clock Tree Synthesis, Detailed Routing and Optimization, in addition to Physical Signoff Verification.
  • Work with Physical Verification Team to clean-up layout violations.
  • Work with foundry to complete tape-out related forms and checks.

Qualifications, Education, and Experience Required:

  • Advanced degree in electronics engineering with 5+ years’ experience in physical design and implementation.
  • Excellence in complete RTL to GDSII flow with strong experience in the usage of industry-standard Electronic Design Automation (EDA) tools for both physical design and timing signoff with a focus on improving PPA (Performance, Power, Area).
  • Deep knowledge on industry standards and practices in physical design including physically aware synthesis flow, floor-planning, place & route, metal fill, chip finishing, signal integrity checks, and static/dynamic EMIR-Drop analysis, and formal ESD verification.
  • Experience in building chip floorplan including partitions and power grid.
  • Experience in Signoff ECO flow to fix timing, noise, IR-Drop and EMIR violations.
  • Experience in physical design verification to debug & fix LVS/DRC/PERC issues at the chip/block level using industry standard tools.
  • Experience in UPF flow.
  • Experience in tape-out related communication with foundry (forms, jobview, etc).
  • Experience in package, RDL routing design.
  • Experience with Programming/scripting languages (e.g., Python or Perl, tcl).
  • Experience with scan insertion and ATPG pattern generation is a plus.
  • Experience with power analysis flows is a plus.

Benefits

About Syntiant:

Founded in 2017 and headquartered in Irvine, Calif., Syntiant Corp. is a leader in delivering hardware and software solutions for edge AI deployment. The company’s purpose-built silicon and hardware-agnostic models are being deployed globally to power edge AI speech, audio, sensor and vision applications across a wide range of consumer and industrial use cases, from earbuds to automobiles. Syntiant’s advanced chip solutions merge deep learning with semiconductor design to produce ultra-low-power, high performance, deep neural network processors. Syntiant also provides compute-efficient software solutions with proprietary model architectures that enable world-leading inference speed and minimized memory footprint across a broad range of processors. The company is backed by several of the world’s leading strategic and financial investors including Intel Capital, Microsoft’s M12, Applied Ventures, Bosch Ventures, the Amazon Alexa Fund, and Atlantic Bridge Capital. More information on the company can be found by visiting.

One element in our total compensation package is base pay. Individual compensation decisions are based on several factors, including but not limited to previous experience and skills acquired prior to joining Syntiant, cost of living in the assigned work location, assigned schedule, and salaries of similarly situated peers at the company. It is to be expected that candidates will come to us with different sets of skills and experiences and therefore will be paid at different points in the stated range. We recognize that the person(s) we select for hire may be less experienced or more experienced than the role as posted; if this is the case, any updates to available salary ranges will be communicated with candidates during the recruitment process.

What this application asks

workable

First name, Last name, Email, Phone, Address, Education, Experience, Resume, LinkedIn link, Available start date, Are you legally authorized to work in the country where this job is located?

  • How many years of hands-on experience do you have in physical design and implementation? Could you share some details about the types of projects you've worked on during this time? written answer
  • Can you describe your experience managing the complete RTL to GDSII physical design flow? How have you contributed to achieving strong performance, power, and area (PPA) outcomes in your previous projects? written answer
  • Could you tell us about your experience building chip floorplans, particularly with partitions and power grid design? written answer
  • What has been your experience with signoff ECO flows to address timing, noise, IR-drop, or EMIR violations? Can you share an example of a challenge you resolved in this area? written answer
  • Can you provide an example of a time you debugged and fixed LVS, DRC, or PERC issues at the chip or block level? What approach did you take? written answer
  • What experience do you have with package and RDL routing design? Please describe the types of projects or challenges you've handled in this area. written answer

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