Summary
Owns block- to full-chip physical design of high-performance SoCs at EV maker Rivian — floorplanning, place-and-route, clock tree synthesis, STA and EM-IR signoff from RTL to GDSII — using Synopsys/Cadence EDA tools, RedHawk voltage-drop analysis, and Python/Tcl scripting through tapeout and production silicon.
About Rivian Rivian is on a mission to keep the world adventurous forever. This goes for the emissions-free Electric Adventure Vehicles we build, and the curious, courageous souls we seek to attract. As a company, we constantly challenge what’s possible, never simply accepting what has always been done. We reframe old problems, seek new solutions and operate comfortably in areas that are unknown. Our backgrounds are diverse, but our team shares a love of the outdoors and a desire to protect it for future generations. Role Summary As a Physical Design Engineer, you will contribute to all design phases of physical design of high performance SoC design at both the block and subchip levels, as well as the full-chip level from RTL to GDSII. You will collaborate with the Foundry Process Engineer, SoC Architect, Microarchitecture, Packaging, Signal Integrity and Power Integrity teams to drive the overall Physical Design aspects, leading to a successful tapeout and production silicon. Responsibilities Perform subchip level and block level place and route, and close design to meeting performance, power and area. Lead and perform all aspects of full chip SoC integration activities: die size optimization, floorplanning, hard IP integration, partitioning, block/chip level clock planning, bump placement / RDL routing, power grid generation, full chip STA timing, DFT strategy planning, and final physical verification. Good knowledge of timing analysis, power analysis, physical verification (DRC/LVS), and formal verification Working knowledge of UPF specification in Power Intent design, implementation, and verification of power gating, level shifter, and isolation. Define EM-IR signoff requirements and sign-off methodology. Define and support Static and Dynamic, thermal, electro-migration, peak current, di/dt, and effective resistance analysis Develop and support Chip-package-Co-Analysis (CPA) and Chip-Power-Model (CPM) on- die model for package & die co-design analysis Be an EM-IR sign-off lead with successful tape out track records Excellent hand-on experience in voltage drop analysis using redhawk or redhawk-SC Excellent hand-on experience and debugging skills of finding root cause of voltage drop and EM issues Solid background in EM-IR fundamentals, analytical aptitude and excellent attention to detail Work closely with the Foundry Engineer and Microarchitecture team to establish logic levels, Multi-Vt library mixes and choices of tracks, metal-stackup, etc. Define flows through various EDA tools and write scripts for automation for floor planning, placement, routing, crosstalk avoidance, judicious usage of cell libraries and physical verification Work with the Microarchitecture, Signal Integrity, Power Integrity and Thermal team to ensure that the floorplan and the logic is designed in such a way such that the Substrate/Packaging and Board Layout and the Power Delivery comprehend the power domains, multiple voltages, power integrity requirements, power gating, specify power sequencing to eliminate leakage paths, always-on power, minimize hot-spots, etc. Design the floorplan to ensure that the power distribution for the chip for the various voltage domains is consistent with the bump and bump-ball map to ensure power integrity (i.e., minimize voltage droop, utilization of local LDOs) and signal integrity (e.g., aggressor nets) Ensure that the clocking architecture is robust and meets the timing requirements – i.e., well versed in Clock Tree Synthesis, Static Timing Analysis, Timing closure methodologies, Clock gating, reference clocks, PLL placement, clock muxing, etc. Well versed in parasitic extraction, LVS/DRC and other verification checks – Physical, Power, Post-Layout Timing Qualifications At least 12 years of experience in the chip industry with a track record of delivering silicon into volume production across multiple technology generations Proven track record of SoC definition of complex SoCs over multiple technology generations BS/MS/PhD in Electrical and Computer Engineering with emphasis on Computer Architecture Experienced in CPU Architecture – preferably Instruction Decode or Execution Units Experience in Multi SoC systems is a plus Knowledge of Machine Learning Algorithms (e.g., Convolutional Neural Networks) is a huge plus Exhibits the right teamwork and leadership qualities backed up with references Extensive physical design experiences at both the block level and subchip level, as well as full-chip level is a plus. Deep knowledge in physical design, including physical aware synthesis, floorplanning, clock tree implementation, routing, STA timing signoff, and chip-finishing. Solid experience in advanced process nodes (e.g. 5nm and below) and associated DRC/DFM challenges Experience with MSCTS or custom H-tree clock implementation Good knowledge of basic soc architecture. Be able to work with Front-end design team to address timing, congestion and power issues. In-Depth Knowledge of design flow from RTL to GDSII. Solid understanding of STA, SDC, MCMM and on-chip variation Good knowledge of EM-IR sign-off requirements. Experience in using EDA tools like Synopsys (/Cadence) for PPA optimization. Good script skills such as python/tcl. Good communication skills: documentation skills and cross-functional skills. Pay Disclosure The listed base salary range for this role is $186,00 - $232,000 for San Francisco Bay Area based applicants. This is the lowest to highest salary we in good faith believe we would pay for this role at the time of this posting. An employee’s position within the salary range will be based on several factors including, but not limited to, specific competencies, relevant education, qualifications, certifications, experience, skills, geographic location, shift, and organizational needs. We offer a comprehensive package of benefits for full-time and part-time employees, their spouse or domestic partner, and children up to age 26, including but not limited to paid vacation, paid sick leave, and a competitive portfolio of insurance benefits including life, medical, dental, vision, short-term disability insurance, and long-term disability insurance to eligible employees. You may also have the opportunity to participate in Rivian’s 401(k) Plan and Employee Stock Purchase Program if you meet certain eligibility requirements. Full-time employee coverage is effective on their first day of employment. Part-time employee coverage is effective the first of the month following 90 days of employment. More information about benefits is available at rivianbenefits.com. Equal Opportunity Rivian is an equal opportunity employer and complies with all applicable federal, state, and local fair employment practices laws. All qualified applicants will receive consideration for employment without regard to race, color, religion, national origin, ancestry, sex, sexual orientation, gender, gender expression, gender identity, genetic information or characteristics, physical or mental disability, marital/domestic partner status, age, military/veteran status, medical condition, or any other characteristic protected by law. Rivian is committed to ensuring that our hiring process is accessible for persons with disabilities. If you have a disability or limitation, such as those covered by the Americans with Disabilities Act, that requires accommodations to assist you in the search and application process, please email us at candidateaccommodations@rivian.com. Candidate Data Privacy and Technology Rivian may collect, use and disclose your personal information or personal data (within the meaning of the applicable data protection laws) when you apply for employment and/or participate in our recruitment processes (“Candidate Personal Data”). This data includes contact, demographic, communications, educational, professional, employment, social media/website, network/device, recruiting system usage/interaction, security and preference information. 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