平头哥-AI芯片互联架构师-上海
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Summary
Architect role at T-Head (Alibaba's chip unit) in Shanghai defining next-generation inter-chip network architectures for high-performance AI chips and AI super pods. Day to day: design chip-to-chip interconnect subsystems and scale-up switch silicon, write architecture specs, and drive silicon delivery with design, software, and verification teams.
In this role, you will work with hardware and software engineering groups to define the next-generation inter-chip network architecture for high-performance AI chip and AI network.
- Identifies the challenging problems, and evaluate various architectural solutions for the next-generation of network for AI chip and AI Super Pod.
- Gets strong influences on future AI products by advanced architecture design as the excellent interface between software and hardware.
- Architecture design of AI chip to chip interconnect subsystem, Scale-up Switch chip, C2C link, and etc.
- Documents the high-level architecture specification.
- Participation in defining the micro-architecture of key subsystem.
- Strong technical leadership to achieve successful delivery of final silicon product.
- Works closely with design, software, system, and verification team.
- Minimum Bachelor degree in Computer Science or Electronics Engineering; M.S. or Ph.D. degree is preferred.
- Minimum of 5 years (for M.S.) 3 years (for Ph.D.) of experience on computer architecture or network chip design.
- Smart and show good potential in at least one of the following areas:
1.Server AI chip.
2.Smart NIC/RDMA/RoCE/DPU.
3.State-of-the-art Switch chip.
- Hand-on experience of high-speed interface, such as Die to Die, high speed long-reach SerDes, MAC/PCS, FEC is a plus.
- Hand-on experience of interconnects in AI domain is a big plus.
- Strong knowledge of AI infrastructure and AI network including Scale-up/Scale-out network, and knowledge of LLM inference and training is a big plus.
- Good verbal and written skill for communication.