Principal AI System Architect
Summary
Principal-level architect defining system-level memory and interconnect architecture that links XPUs (NPU/GPU/custom silicon) across node, rack, and cluster scales, so large-scale LLM training and inference run efficiently. Requires deep hands-on NPU/ASIC hardware expertise and cross-functional leadership across silicon, memory, networking, and software teams.
Base salary range is $220,000 - $280,000 a year. The base salary offer will depend on factors such as education, experience, training, skills, qualifications, and location. This position is also eligible for a discretionary bonus, equity and a full range of medical and other benefits.
Why Credo
- Purpose: We invest in what matters. From meaningful-future shaping projects to competitive compensation, we empower you to grow your career while making a lasting impact.
- People: Connection starts within. We collaborate, celebrate wins, and create an environment where everyone can do their best work.
- Possibilities: Our belief shapes what’s next. Our technology powers the most reliable and energy-efficient connections around the world – and our team powers new products and markets that come next.
Responsibilities
- Define the memory and interconnection architecture linking XPUs to memory and across node, rack, and cluster boundaries -not the internal design of the NPUs/GPUs/CPUs themselves.
- Solve communication and topology bottlenecks that arise from all kinds of parallelism strategies during distributed LLM training and inference.
- Define how XPUs utilizes the memory and interconnect fabric, ensuring workloads map cleanly onto the network topology.
- Work with silicon, memory, networking, and software teams to specify interconnect fabric requirements and resolve integration issues between compute nodes.
- Bring hands-on NPU hardware architecture judgment to interconnect and system design decisions, informed by direct experience taking NPU silicon from definition through bring-up, validation, and production deployment.
- Track leading open LLM architectures to anticipate how model structure will stress interconnect and system topology.
- Lead and mentor a team of architects focused on system interconnection; represent this strategy to leadership and partners.
Requirements
Basic Qualifications- Bachelor's degree in Computer Engineering, Electrical Engineering, Computer Science, or related field required
- Ten years in XPU or AI interconnect system design, architecture and micro architecture working experience.
- Five cycles of complete ASIC tapeouts.
- Strong foundational understanding of computer architecture, including GPU, NPU, and/or CPU design principles; deep, hands-on NPU hardware architecture expertise.
- Familiarity with large language model architectures and distributed training/inference concepts (e.g., parallelism strategies, model serving) through coursework, research, or personal projects.
- Demonstrated analytical ability, for example, through published research, thesis work, or quantitative project work- with a track record of independently studying and synthesizing technical material.
- Strong cross-functional leadership and communication skills, daily experience working with compiler, software, SOC & backend team.
- Master's degree or PhD in a relevant technical field.
- Direct NPU tapeout and production ramp experience.
- Hands-on NPU hardware background, with direct experience carrying an NPU design from architecture definition through silicon bring-up, validation, and volume production deployment.
- Working knowledge of high-speed interconnect or networking concepts (e.g., PCIe, Ethernet, RDMA).
Benefits
Credo’s mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. Our high-speed copper and optical interconnect products deliver industry-leading power and performance at up to 1.6T to meet the ever-expanding data infrastructure demands of AI.Our product portfolio includes ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers, OmniConnect memory solutions, and a suite of retimers and DSPs for optical and copper Ethernet and PCIe, all leveraging the PILOT diagnostic and analytics software platform. Credo innovations enable our customers to connect the systems that connect the world.
Credo is committed to creating an inclusive environment for all employees and welcome applicants from diverse backgrounds without regard to race, color, religion, gender, sex, gender identity, sexual orientation, pregnancy, marital status, national origin, ethnicity, genetic information, age, disability, veteran status, or any other legally protected basis. If you have a disability or special need that requires accommodation to navigate our website or complete the application process, email people@credosemi.com.
What they ask for
Required
- Bachelor's degree in Computer Engineering, Electrical Engineering, Computer Science, or related field
- Ten years in XPU or AI interconnect system design, architecture and micro architecture working experience
- Five cycles of complete ASIC tapeouts
- Strong foundational understanding of computer architecture, including GPU, NPU, and/or CPU design principles; deep, hands-on NPU hardware architecture expertise
- Familiarity with large language model architectures and distributed training/inference concepts (e.g., parallelism strategies, model serving)
- Demonstrated analytical ability (e.g., published research, thesis work, or quantitative project work) with a track record of independently studying and synthesizing technical material
- Strong cross-functional leadership and communication skills, with daily experience working with compiler, software, SOC & backend teams
Preferred
- Master's degree or PhD in a relevant technical field
- Direct NPU tapeout and production ramp experience
- Hands-on NPU hardware background, with direct experience carrying an NPU design from architecture definition through silicon bring-up, validation, and volume production deployment
- Working knowledge of high-speed interconnect or networking concepts (e.g., PCIe, Ethernet, RDMA)