Product Engineering Lead

Аbout GlobalFoundries

GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit .

Key Responsibilities:

• Own end-to-end New Product Introduction (NPI) execution for optical interconnect solutions from engineering prototypes through manufacturing release, production qualification, and volume ramp.
• Drive manufacturing readiness for Co-Packaged Optics (CPO) and pluggable optics products, ensuring process flows, assembly methods, test coverage, tooling, documentation, and supplier readiness are in place before production release.
• Develop and manage production test strategies, characterization plans, qualification plans, and release criteria for high-speed optical products supporting 100G, 200G, and 400G per lane architectures.
• Lead cross-functional readiness reviews with design, device, packaging, assembly, test, reliability, quality, operations, and supply chain teams to identify risks, close gaps, and enable predictable product launches.
• Translate product requirements and design intent into manufacturable, scalable, and repeatable production processes, including clear requirements for optical coupling, packaging, calibration, burn-in, final test, and outgoing quality control.
• Define and track NPI milestones, build plans, qualification deliverables, yield targets, ramp metrics, and production release gates across EVT, DVT, PVT, qualification, and mass-production phases.
• Lead yield optimization activities by analyzing electrical, optical, packaging, and assembly data; identifying dominant failure modes; and driving corrective actions with engineering, manufacturing, and supplier partners.
• Own structured root-cause analysis and corrective-action closure for production excursions, qualification failures, reliability issues, and early ramp yield limiters.
• Establish data-driven dashboards and reporting mechanisms to monitor test coverage, parametric distributions, yield trends, reliability performance, factory readiness, and production ramp health.
• Partner with external OSATs, module manufacturers, component suppliers, and internal manufacturing sites to ensure process capability, quality controls, traceability, and ramp capacity are aligned with product launch objectives.
• Support design-for-manufacturing, design-for-test, design-for-quality, and design-for-reliability reviews, ensuring lessons learned from prototype and ramp builds are fed back into product and process improvements.
• Serve as the product engineering technical owner during production ramp, balancing quality, cost, yield, cycle time, manufacturability, and customer-readiness requirements.

Required Qualifications:

• Bachelor’s degree in Electrical Engineering, Photonics, Optical Engineering, or a related technical discipline; advanced degree preferred.
• 10+ years of experience in product engineering, NPI, manufacturing engineering, test engineering, quality engineering, or production ramp for semiconductor, photonics, optical module, or high-speed interconnect products.
• Demonstrated ownership of NPI programs from prototype builds through qualification, manufacturing release, and volume production ramp.
• Strong understanding of optical interconnect products, including optical transceivers, silicon photonics, photonic integrated circuits, lasers, modulators, detectors, optical engines, optical coupling, packaging, and module assembly.
• Experience with high-speed optical and electrical test methodologies, including production test development, calibration, test correlation, and data analysis.
• Hands-on familiarity with optical and electrical measurement equipment such as BER testers, oscilloscopes, optical spectrum analyzers, optical power meters, network analyzers, thermal chambers, and automated test systems.
• Experience developing qualification and reliability plans for telecom/datacom or semiconductor products, including environmental, mechanical, optical, electrical, and lifetime stress testing.
• Proven ability to analyze yield data, identify systematic failure modes, lead root-cause analysis, and drive corrective actions across design, process, test, assembly, and supplier interfaces.
• Experience working with OSATs, contract manufacturers, component suppliers, foundries, or global manufacturing sites in a high-complexity product environment.
• Strong cross-functional leadership skills with the ability to influence engineering, operations, quality, reliability, supply chain, and executive stakeholders in a matrixed global organization.
• Excellent written and verbal communication skills, with the ability to present technical risks, readiness status, yield trends, and ramp plans clearly to both technical and non-technical audiences.
• Self-directed, structured, and detail-oriented, with the ability to operate effectively in ambiguous, fast-moving product-development environments.

We Offer

• Base Salary
• Equity
• Annual Bonus Plan
• Medical Insurance