Senior HBM Product and System Engineer, Heterogeneous Integration Group
台灣美光(台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司) Senior HBM Product and System Engineer, Heterogeneous Integration Group
Description
Please find the details and apply here: https://micron.wd1.myworkdayjobs.com/External/job/Taichung---Fab-16-Taiwan/Senior-Engineer--HIG-HBM-Media-Health_JR105577
As a member of the HIG HBM Media Health HVM team, you will embody an outstanding approach to Next Generation HBM Product driven by important metrics: Quality, Cost, Cycle Time, and Scale. You will work closely with various teams within and outside of HBM to achieve strategic and operational goals.
Key Responsibilities
Optimized Test Coverage: Ensure optimized test coverage on all current and future HIG HBM design architectures and process nodes to maintain effectiveness and efficiency in high-volume manufacturing.
Encouraging Innovation: Motivate innovation and inspire changes that will help Micron maintain a technical advantage over its competition, ensuring Micron’s competitive edge in the market.
Product Development and Validation: Develop, validate, characterize, and qualify Micron’s next-generation HBM products, ensuring reliability and market readiness.
Support for New Product Design Validation: Provide support for design verification and in-depth circuit analysis of new products using CAD tools and Verilog simulations.
Yield Improvement and Cost Reduction: Improve manufacturing test yields, reduce test time, and resolve yield-related issues, contributing to cost reduction and meeting yield targets.
Root Cause and Resolution of Qual and RMA Device Issues: Identify and resolve issues related to device qualification and return material authorization, ensuring product quality.
Process Conversions and HVM: Recommend process conversions to fab teams to reduce cost and increase yields, directly impacting the yield, quality, reliability, and performance of HBM products.
Balance innovation and stability by considering candidates with DPM or equivalent experience.
Mentorship and Development of Others: Actively develop and mentor team members, encouraging growth and development within the organization.
Project Management: Develop project management skills within the team to ensure efficient execution of projects and timely delivery of technological solutions.
Technical Decision Making: Make final decisions on risk analysis and project prioritization, directly impacting the direction of technological development.
Collaborate with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, Test Program Development, and Quality/Reliability team for the complete development and shipping of end products.
Requirements
Bachelor’s or Master’s degree in Electrical Engineering with 5+ years of experience in the semiconductor industry. Micron and Product Engineering experience is preferred.
Demonstrating Strong Leadership Skills and Technical Skills with 5+ years of experience in the semiconductor industry.
Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment, from leading the team to leading technical programs.
Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.
Strong sense of responsibility and accountability towards the assigned role with a professional work ethic.
AI-enabled mindset and AI-assist working experience.
Preferred professional skills
Programming skills/experience (Python a plus)
Logic gate and transistor operation knowledge
Circuit simulation or circuit debug skills/experience
Familiarity with DRAM operation a plus
Semiconductor process knowledge a plus
AI tool skills/experience (Claude code a plus)
歡迎身心障礙/神經多樣性人才投遞
美光身心障礙人才友善職涯入口: https://tw.micron.com/about/careers/people-with-disabilities