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Kandou AI

Open 23d

Software Architect

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Summary

Architects the CMIS 5.x firmware/software stack for Kandou's chiplet-based AI memory fabric — leading hyperscaler interop testing, manufacturing test orchestration, telemetry pipelines, and customer SDK/tooling. Built around C/C++, Python (plus Go/Rust), I2C/MCTP, and optical interconnect standards like OSFP MSA and SFF-8024.

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.

We are actively seeking a Software Architect either based in Hyderabad OR Bangalore.

Responsibilities:

  • Architect CMIS 5.x stack (DataPath State Machine, VDM, I2C/MCTP, FW-SW interface)

  • Lead host interop tests for hyperscalers (Meta, AWS, etc.), build test matrix and regression suite

  • Develop manufacturing test orchestration (ATE integration, yield analytics, on-chip stimulus)

  • Build telemetry pipeline from FW to host/cloud (formats, compression, SDK APIs)

  • Own customer SDK and tools (C/Python, CLI, log analysis), release management

  • Ensure standards compliance (CMIS 5.x, OSFP MSA, SFF-8024, OIF)

  • Travel: Up to 25% (customer engagement, manufacturing, standards)

Skills:

  • Good knowledge of C/C++, Python, systems language (Go/Rust); CI/CD, conformance tests

  • Good knowledge of I2C/MCTP, SFF-8024, vendor extensions

  • Good understanding of standards implementation (OIF, SFF, IEEE mgmt-plane)

  • Good knowledge of architecture documentation (SHALL/MUST, REQ traceability)

  • Self-motivated, with strong sense of ownership and responsibility

  • Good communication and reporting skills

Experience:

  • Principal / Senior Staff (8-10 years post-degree)

  • 8-10 years high-speed interconnect software (module SW, management, test, SDK)

  • CMIS 4.x/5.x implementation and OSFP MSA experience

  • Hyperscaler interop with NIC/switch ASICs (Nvidia, Broadcom)

  • Test software architecture with ATE/yields

  • Manufacturing and field support experience

Education:

  • BS in Electrical Engineering, Computer Engineering, or Computer Science (MS preferred)

If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!

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