Sr. Engineer_ChuPei
Posted Updated
Description
1. Work on 7nm~3nm physical design implementation, methodology, and sign-off
2. Perform floorplan, clock planning, place and route, timing closure, ECO, IR signoff, and physical verification
3. Manage schedule, resolve design and flow issues, drive methodologies and execution
Requirements
1. MS +2yrs in EE/CS
2. APR/Signoff hands-on and tapeout experience in deep submicron technology
3. Tcl/Perl/script/C/C++ programming skills
4. Strong communication skills
Education: Master's Degree
