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研發-IC Package Bumping Design Engineer-湖口廠-ATT250031
APAC
Taiwan
Hukou Township, Hsinchu CountyThe Advanced Product Development Team at Amkor has an opening for bumping mask design Engineer. This team is responsible for wafer & wafer level package physical mask & stencil design, design implementation, design…
1 views 3 weeks ago
研發-Package Design Engineer-台元辦公室-ATT240059
APAC
Taiwan
Zhubei City, Hsinchu County如欲投遞履歷,請上Amkor官網 https://careers.amkor.com.tw/ The Advanced Product Development Team at Amkor has an opening for IC Package design engineer. This team is responsible for design methodology, design implementation and…