神準科技股份有限公司
Open positions
(16B1)BSP軟韌體工程師
Position Purpose : 1. Develop and maintain x86 (Intel/AMD) BSP solutions. 2. Act as the core technical contact, collaborating with internal teams (HW, BIOS) and assisting customers to resolve technical issues from…
(16C0)軟/韌體工程師 (x86 BSP)
1.協助Intel /AMD Server平台之Linux BSP、系統整合與維護。 2.協助平台Bring-up及硬體功能驗證。 3.開發或維護系統診斷工具與自動化測試程式。 4.分析Linux System Log、Kernel Message及硬體異常現象，協助進行問題定位。 5.與BIOS、BMC、硬體及測試團隊合作，完成Server平台整合與功能驗證。 6.撰寫及維護測試報告、技術文件與問題分析紀錄。
(17B6) IOT 軟/韌體工程師-林口
1. Firmware development for IoT product. 2. Bring up board and BSP development. 3. Device driver porting. 4. Product verification and trouble shooting. 5. Manufacture issues supports.
(16C0)軟/韌體資深/主任工程師 (x86 BSP)
1. Firmware Development based on BSP/SDK of Intel x86 platform. 2. Porting device drivers to target platform. 3. Product's functional and performance verification. 4. Experienced with programming some of the following…