<Data Center>Senior/Lead DFT CAD and Methodology Engineer

We are looking for a highly skilled DFT CAD and Methodology Expert to develop and deploy advanced test methodologies for next-generation data center and AI ASIC. Enhancing the efficiency and quality of our ASIC development and testing procedures. The successful candidate will work within the CAD team to innovate test solutions for complex 2.5D/3DIC, ensuring high quality and yield for advanced packaging technologies.

Key Responsibilities
•_x0001_Methodology Development: Develop and deploy robust CAD flows for scan insertion, ATPG, pattern simulation, and Memory BIST (MBIST).
•_x0001_Tool Automation: Create scripts (Python, TCL, Perl) to enhance and automate DFT flows, accelerating simulation runtimes and improving quality of results (QOR).
•_x0001_EDA Tool Integration: Collaborate with EDA vendors to enhance tools for advanced packaging, including test verification and pattern generation.
•_x0001_Support & Debug: Support DFT integration teams with CAD flow issues, debug complex issues, and provide technical mentorship.
•_x0001_3DIC/2.5D Expertise: Develop and implement testing strategies for chiplets and TSV-based 3D stacks.
Location: Hsinchu, Taipei, Singapore.

Requirements

•_x0001_Experience: 5+ years of experience in DFT methodology development, EDA CAD flow, or physical design.
•_x0001_Tools: Expertise in industry-standard tools, such as Synopsys (DFTMAX, TetraMAX, StarRC) or Mentor Graphics (Tessent).
•_x0001_Programming: Proficiency in Python, TCL, and Shell scripting. System C knowledge is a plus.
•_x0001_Knowledge: Solid understanding of SCAN, ATPG, MBIST, and IEEE1149.1 Boundary Scan architectures. Experience with high-speed interfaces (PCIe, HBM) is also a plus.
•_x0001_Education: B.S./M.S. in Electrical Engineering, Computer Engineering, or related field.
Preferred Qualifications
•_x0001_Experience in data center or AI SoC design environments.
•_x0001_Experience with Machine Learning for optimization in CAD flows.
•_x0001_Experience with advanced technology nodes (< 7nm).
•_x0001_Strong collaboration skills to work with cross-functional, global teams.
•_x0001_Excellent problem-solving skills to analyze CAD/DFT issues and implement solutions.
•_x0001_Ability to drive tool evaluations and make data-driven decisions.