ENGR I, MANUFACTURING EQUIP; MFG
Summary
Engineer responsible for maintaining and improving semiconductor assembly equipment, ensuring reliability and supporting new product development through process optimization and team coordination.
Responsible for supporting Assembly manufacturing equipment, driving equipment reliability and leading New Product Introduction (NPI) activities for new package and product development.
• Support assembly equipment uptime, OEE and maintenance programs.
• Lead equipment qualification and readiness for NPI programs.
• Coordinate with Process, Product, Quality and Manufacturing teams.
• Develop machine recipes, tooling and process parameters.
• Support DOE, process characterization and improvement projects.
• Drive yield, cycle time and productivity improvements.
• Maintain engineering documentation and compliance requirements.
• Bachelor Degree in Engineering.
• 3–5 years semiconductor assembly experience.
• Experience with Die Attach, Wire Bond, Sintering, Molding, Singulation or related equipment.
• Familiar with SPC, FMEA, 8D and DOE methodologies.
• Strong analytical and communication skills.