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Principal engineer at ams OSRAM's Bayan Lepas site leading LED package design: translating customer and application requirements into product designs, running simulations and technical risk assessments, validating prototypes with cross-functional teams, and driving manufacturability for new product introduction. Core focus is LED packaging technology and design reliability.
Senior SAP Basis engineer at ams OSRAM in Bayan Lepas, Malaysia, supporting S/4HANA transition projects and administering SAP systems across on-premise, private cloud, and hybrid landscapes — handling installs, upgrades, migrations, health checks, troubleshooting, and performance tuning alongside global hosting partners.
Senior IT engineer at ams OSRAM in Bayan Lepas (Penang, Malaysia) who owns the lifecycle of global planning and manufacturing execution systems (MES), leads cross-site digitalization and upgrade projects, and provides 2nd/3rd-level support. Focus areas: system architecture, requirements workshops, vendor coordination, testing, data analysis, and governance for cybersecurity and audit compliance.
ams OSRAM is hiring an Agentic AI Engineer in Carnaxide, Portugal, to build and deliver enterprise Generative AI/LLM and agentic solutions. Day to day involves developing AI applications with Python and/or JavaScript/TypeScript on Azure OpenAI/AI Services, using RAG and vector search, and integrating them with Microsoft 365, APIs, and cloud platforms.
Principal high-speed digital design engineer at ams OSRAM in Pavia, Italy, working on digital IC design for communication and mixed-signal SoC products: RTL design in Verilog/SystemVerilog, synthesis, timing analysis, clock-domain crossing, and advanced CMOS nodes (FinFET/FD-SOI). Knowledge of UCIe/PCIe interfaces is an advantage.
ams OSRAM is hiring a Senior Digital Design Backend Engineer in Pavia, Italy, to implement and sign off digital IC designs using the Cadence backend flow — handling timing closure, signal integrity, EMIR, and physical verification for its optoelectronic semiconductor products.
Senior principal-level analog IC design role at ams OSRAM in Pavia, Italy, focused on high-frequency analog and mixed-signal circuits for broadband optical communication — HF amplifiers, TIAs, drivers, PLLs, CDRs, ADCs/DACs — in advanced CMOS nodes such as FinFET and FD-SOI.
ams OSRAM seeks a Senior Principal Engineer in Pavia, Italy, to architect broadband optical communication ICs — defining PHY architectures such as TIAs, VCSEL drivers, SerDes, PLL/CDR and ADC/DAC blocks in advanced CMOS (FinFET/FD-SOI) nodes. Day-to-day work centers on high-speed optical link design and system-level trade-offs using MATLAB/Python modeling.
ams OSRAM is hiring an Integration Platform Engineer in Bucharest (Sector 2) to administer and support its SEEBURGER BIS 6.7 integration platform. Day-to-day work involves BIS administration, BIC/BIS mapping, B2B/A2A/API data formats and transmission technologies, and SQL/database troubleshooting on Microsoft SQL Server and Oracle.
Owns the architecture, governance, and lifecycle of ams OSRAM's global OpenShift container and VMware virtualization platforms, defining service strategy, SLAs/KPIs, and security posture while steering an external provider's day-to-day operations, including incident escalations, audits, and capacity/cost planning. Role can be based in Spain, Romania, Malaysia, or the Philippines.
Director-level role at ams OSRAM in Kulim, Malaysia, leading frontend semiconductor process development for optoelectronic devices. The person manages cross-functional teams, drives process optimization and problem-solving (DoE, FMEA, 8D), and requires 10+ years in semiconductor technology, R&D, and leadership.
ams OSRAM is hiring a Senior Project Manager in Kulim, Malaysia to lead complex nitride (AlInGaN) LED chip development projects, coordinating global/international teams and traveling regularly to headquarters in Germany. The role requires a physics/engineering degree and deep semiconductor and device-physics knowledge.
Senior Staff Engineer at ams OSRAM in Kulim, Malaysia, working on semiconductor chip design and device development for nitride LEDs — covering wafer fabrication processes, frontend semiconductor processes, and device physics. Requires 5+ years of semiconductor industry experience and a degree in physics, optics, electrical engineering, or materials science.
Customer-facing system solution engineer at ams OSRAM defining CMOS IC system architecture for optical interconnects used in AI and data-center datacom. Works hands-on with hyperscalers, networking and optical module makers, translating customer architectures into IC product concepts, design-ins, white papers and technology roadmaps spanning optics, photonics, mixed-signal ICs and packaging.
ams OSRAM is hiring a System Solution Engineer in Eindhoven to develop optical interconnect CMOS IC solutions for datacenter datacom links, working at the system level across optics, electronics and packaging. Day to day involves mixed-signal CMOS, photodiodes, TIAs, drivers and SerDes, plus global customer engagement (~50% travel).
Senior digital IC design engineer at ams OSRAM's Plano, TX site who designs, verifies, synthesizes, and brings up silicon for sensor/imaging mixed-signal semiconductors. Core stack: Verilog/SystemVerilog, UVM, low-power and CDC/LEC flows, and Cadence tools like Xcelium, Genus, SpyGlass, and JasperGold.
(Senior) Project Manager who runs end-to-end technology development projects at ams OSRAM — from feasibility through full development and industrialization — building project plans, managing risks and R&D resources, and steering cross-functional teams through the company's I2T/I2P stage-gate process to deliver milestones on time, on budget and on spec.
(Senior) Project Manager at ams OSRAM in Premstätten, Austria, running technology development projects end to end — from feasibility studies through industrialization — planning resources, budgets/CAPEX and timelines, managing risks, and coordinating cross-functional teams per the ams OSRAM I2T/I2P development process.
Product manager for Time-of-Flight optical sensing products at semiconductor maker ams OSRAM, based in Premstätten, Austria. Owns roadmaps, business cases, pricing and lifecycle decisions for ToF/3D sensor technologies in a global matrix organization, working across technical, commercial and leadership stakeholders.
ams OSRAM is hiring a Product Manager for its Time-of-Flight sensing portfolio in Premstätten, Austria. The role owns roadmaps, business cases, pricing, forecasting and customer requirements for optical 3D sensing products (ToF, VCSEL, photodiodes, sensor modules) within a global semiconductor matrix organization.
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