英屬開曼群島商世芯股份有限公司台灣分公司
Open positions
Sr. Assembly Package Engineer (Co-design)
1. Collaborate with OSATs' engineering/substrate design team and IC designer/SIPI team to deliver robust package design solutions. 2. Participate IC package substrate design review, and initiate package specs and…
【2027研發替代役】Analog / Mixed Mode IC Designer
Responsible for developing custom IP for SoC design from specification definition, circuit design to testing, and familiar with component and process characteristics.
Analog / Mixed Mode IC Designer
Responsible for developing custom IP for SoC design from specification definition, circuit design to testing, and familiar with component and process characteristics.
Design Technology Engineer
Dual responsibilities for design infrastructure setup: 1. Foundry technology a) Establish SOC design infrastructure, including PDK integration, reference flows, SC, IO, Memory Compliers, IPs, design rule decks, to…
Physical Design Manager
1. Responsible for the digital back-end physical implementation from netlist to GDS, completing the chip sign-off process. 2. Complete the full-chip floorplanning, including chip partitioning, power and ground network,…