捷康半導體有限公司
Open positions
【美商】Sr. Process Chief Engineer資深製程工程師/Process Chief Engineer製程工程師
1.負責製程開發、參數優化、成本優化及良率提升 Responsible for process development, parameter optimization, cost reduction and yield improvement 2.分析生產異常並提出改善對策 Analyze manufacturing issues and implement corrective actions 3.確保產品品質與生產效率穩定…
【美商】IE工程師
負責封裝與測試之產能分析、成本計算與 Cost down 目標分析，主導廠區 Layout 設計，機台產能規劃、CAPEX評估、機台請購與交期監控，確保產能符合訂單需求。 Responsible for capacity analysis, cost calculation, and cost-down target analysis for assembly and test operations. Leads plant…
【美商】設備工程師(產能與成本分析)(Equipment Engineer_Capacity & Cost Analysis）
負責封裝與測試之產能分析、成本計算與 Cost down 目標分析，主導廠區 Layout 設計，機台產能規劃、CAPEX評估、機台請購與交期監控，確保產能符合訂單需求． 【主要職責】[Key Responsibilities] 一、產能分析(Capacity Analysis) 1.封裝與測試產能分析，擴充計畫建議與進度跟催，確保產能符合訂單需求 Conduct packaging and testing capacity…
【美商】FT maintain engineer (後段測試維修工程師)
1. Familiarized with final testing process optimization.熟悉final testing的作業。 2. Modified machine capability/function to meet planning schedule for any conversion of part number or package…
【美商】資深維修工程師 (BWL DA封裝)
1. Familiarized with Cu Wire Bonding process optimization. 2. Responsible for qualification lot build. 3. 8D method to solve process issue. 4. New process, new material development with the best quality, yield for mass…