Application Engineer (Semiconductor, Ubi)
Summary
Provides on-site technical support and process development for semiconductor customers, focusing on dicing, grinding, or laser processes.
Responsibilities
- Support process development activities for customers
- Perform in-house application test cutting and provide on-site technical support
- Handle customer claims related to abrasive products and recommend solutions
- Collaborate closely with engineers based in Japan on technical matters
- Participate in company-organized events and initiatives
- Foster strong interdepartmental collaboration and teamwork
- Build and maintain long-term relationships with customers
- Carry out additional operational tasks as assigned
Requirements
- Minimum 1 year of relevant working experience, preferably in the semiconductor industry
- Knowledge or experience in dicing, grinding, or laser processes is an added advantage
- Technical expertise in blade, wheel, or laser support is an added advantage
We regret that only shortlisted candidates will be notified. However, all applications will be updated to our resume bank for future opportunities.
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EA Personnel Name: Saito Ryuya
EA Personnel Reg. no.: R23116168
EA License no.: 07C5771